LayTec – integrated metrology for advanced processes
- Talk at apc|m Conference 2024: ICP-etching of GaN HFET structures: real time statistical process control of nm-thick GaN layers by means of end point detection
- AlignR: LayTec’s solution for assisted alignment of wafer bow-resistant measurement heads
- New video available on YouTube: Follow an epi-wafer on its path through the EpiX station
- Watch the recording from the "Non-destructive Quality Control of PV Module Encapsulation" webinar featuring Dr. Christian Camus
- Dr. Johannes Zettler's talk on "Connected metrology" at the Malvern Panalytical Future Days event on YouTube
- Connected metrology - characterizing complex layer stacks along the manufacturing chain
- In-situ growth control during MOVPE of far-UV-C LED structures with optical metrology
- In-situ monitoring of 2D materials epitaxy during chemical vapor deposition
Benefits of integrated metrology
- Quick identification of process deviations
- Optimization of thin-film quality
- Enhancement of production efficiency and yield
- Fast transfer of established processes
- Fast track to new materials and processes
