LayTec – integrated metrology for advanced processes
- Coming soon: LAYTEC'S NEW WEBSITE! Stay tuned...
- Talk at the Perovskite Forum 2025: Recent advances in in-situ and in-line monitoring of perovskite thin film formation
- Talk at the apc|m conference: Robust and automatic dual wavelength-based endpointingfor consistent batch-to-batch plasma etching of InP-based lasers
- Press Release: Caelux selects LayTec to ensure unprecedented quality of perovskite-based solar glass
- Our "EpiNet Algorithm Deep-Dive series" available as PDF now! Check the PDF here: Deep Dive #1 Deep Dive #2 Deep Dive #3 Deep Dive #4 and Deep Dive #5
- Talk at the IEEE Photonics Conference in Rome: In-situ and in-line metrology in frontend production of ultra-high-yield diode lasers
- Talk at apc|m Conference 2024: ICP-etching of GaN HFET structures: real time statistical process control of nm-thick GaN layers by means of end point detection
- AlignR: LayTec’s solution for assisted alignment of wafer bow-resistant measurement heads
- New video available on YouTube: Follow an epi-wafer on its path through the EpiX station
- Watch the recording from the "Non-destructive Quality Control of PV Module Encapsulation" webinar featuring Dr. Christian Camus
- Talk on "Connected metrology" at the Malvern Panalytical Future Days event on YouTube
- Connected metrology - characterizing complex layer stacks along the manufacturing chain
Benefits of integrated metrology
- Quick identification of process deviations
- Optimization of thin-film quality
- Enhancement of production efficiency and yield
- Fast transfer of established processes
- Fast track to new materials and processes
