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LayTec – integrated metrology for advanced processes
News
Talk at apc|m Conference 2024: ICP-etching of GaN HFET structures: real time statistical process control of nm-thick GaN layers by means of end point detection
AlignR: LayTec’s solution for assisted alignment of wafer bow-resistant measurement heads
New video available on YouTube: Follow an epi-wafer on its path through the EpiX station
Watch the recording from the "Non-destructive Quality Control of PV Module Encapsulation" webinar featuring Dr. Christian Camus
Dr. Johannes Zettler's talk on "Connected metrology" at the Malvern Panalytical Future Days event on YouTube
Connected metrology - characterizing complex layer stacks along the manufacturing chain
In-situ growth control during MOVPE of far-UV-C LED structures with optical metrology
In-situ monitoring of 2D materials epitaxy during chemical vapor deposition
Benefits of integrated metrology
Quick identification of process deviations
Optimization of thin-film quality
Enhancement of production efficiency and yield
Fast transfer of established processes
Fast track to new materials and processes
Meet LayTec at...
Dry Processing Workshop
IWN 2024
Semicon Europa
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