Practically all modern electronic devices rely on electronic circuits consisting of thin film structures of increasing complexity. These devices are currently facing two main challenges:
Nowadays, size reduction is approaching its physical limitations. Therefore, even more complex multilayer structures are currently introduced in semiconductor manufacturing in order to overcome or avoid these limitations. Two prominent examples are next generation solid state memories and planar optical MEMS.
The complexity of such devices requires entirely new methods of process control for various reasons:
Therefore, in-situ metrology is indispensable to meet both quality and cost targets for the next generation of devices. LayTec’s EpiTT UV tools is successfully applied to monitoring the growth of complex multilayer stacks in plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD) as well as epitaxial methods. Find out more in our application note or contact firstname.lastname@example.org for further information.