GaN based epitaxy on silicon (Si) is very challenging because of the thermal mismatch between GaN and Si, which causes extreme tensile stress after cooling. For such applications LayTec‘s EpiCurve®TT is the tool of choice for a precise in-situstrain engineering. Prof. Alois Krost and his team at the Otto-von-Guericke University (OvG) in Magdeburg, Germany, applied the tool to develop a new strain
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